The instrument for non-destructive testing bonded or laminated components by Mechanical Impedance Analysis (MIA)
A1610 BondVisor is a handheld instrument for detecting delaminations and other material defects by manually scanning the inspection area. Changes in mechanical impedance created by defects and imperfections in laminated materials and honeycomb structures. The coupling of the sensor is done dry without coupling liquid. The constant pressure of the spring-loaded sensor guarantees stable and reliable indications.
The main application field of the A1610 BondVisor is the non-destructive testing of laminated components and bondings.
The instrument is applicable for the following materials and material combinations:
Possible sources of material defects:
Measurement principle | Mechanical Impedance Analysis (MIA) |
Inspection range by two MIA transducers | 0.15 mm to 13 mm / 0.006 to 0.5 inches (depending on material properties) |
Flaw detection capability |
For laminated components: > dia 8 mm / 0.3 inch For metal alloy bondings: > dia 0.5 mm / 0.02 inch with the sizing accuracy < 25% |
Transmitter type | Pulse excitation |
Electronic unit dimensions |
159 x 77 x 35 mm 6.3 x 3 x 1.4 inches |
Weight | 0.3 kg / 0.66 lbs |
Display | 2.4-inch color display 240x320 TFT |
Battery type | 3 x NiMH accu/battery with ³ 2.700 mAh |
Battery operation time | up to 20 hours |
PC interface |
USB (for loading user pre-sets) |
Environmental conditions |
Air temperature range: 10 to 50 °C / 50 to 122 °F Humidity: up to 98% (at 20 °C) |
Electronic unit | 1 |
Single-element MIA transducer | 1 |
Dual-element MIA transducer | 1 |
Reference block Co-91 | 1 |
Exchangeable NiMH battery | 3 |
USB data cable | 1 |
Flash drive with recovery | 1 |
Power supply | 1 |
Warranty certificate | 1 |
Hard case | 1 |
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